CoolIT Systems’ Server Modules can cool any combination of CPU, GPU and Memory components, with customization available for VR, ASIC, FPGA and other devices. Servers remain hot-swappable and simple to service.
CoolIT Systems’ CPU Cooling solutions are managed by centralized pumping architectures. These passive coldplate assemblies are purpose-designed to accommodate lower profile footprints, such as 1U blades and other custom chassis.
The R4 is a passive Coldplate technology employed by CoolIT Systems in centralized pumping architectures. At only 15mm in height, the R4 Passive Coldplate Assembly is purpose-designed to accommodate lower profile footprints, such as 1U blades and other custom chassis, and is guaranteed to withstand over 200psi.
The CoolIT Systems’ RP2 is a high performance passive component for use in the CoolIT Systems Rack DCLCTM ecosystem. Specifically designed for use with the Intel® Xeon PhiTM Processor Family (Knights Landing), this solution enables 1U chassis applications by meeting the same keep out zone requirements as the 1U air cooler.
Thermally, the solution is optimized for the unique power distribution of the Knights Landing package, to ensure appropriate cooling for both the CPU and the MCDRAM.
Engineered for the next generation Intel® Xeon® E5 processor (Skylake EP) family, the CoolIT RX1 passive coldplate assembly enables the highest wattage CPUs. Leveraging our patented CoolIT Split-Flow design theory, this passive solution eliminates the need for remote heatsinks, maximizing density in 1U applications.
The R4 is a passive Coldplate technology employed by CoolIT Systems in centralized pumping architectures. At only 15mm in height, the R4 Passive Coldplate Assembly is purpose-designed to accommodate lower profile footprints, such as 1U blades and other custom chassis, and is guaranteed to withstand over 200psi.
The CoolIT Systems’ RP2 is a high performance passive component for use in the CoolIT Systems Rack DCLCTM ecosystem. Specifically designed for use with the Intel® Xeon PhiTM Processor Family (Knights Landing), this solution enables 1U chassis applications by meeting the same keep out zone requirements as the 1U air cooler.
Thermally, the solution is optimized for the unique power distribution of the Knights Landing package, to ensure appropriate cooling for both the CPU and the MCDRAM.
Engineered for the next generation Intel® Xeon® E5 processor (Skylake EP) family, the CoolIT RX1 passive coldplate assembly enables the highest wattage CPUs. Leveraging our patented CoolIT Split-Flow design theory, this passive solution eliminates the need for remote heatsinks, maximizing density in 1U applications.
CoolIT Systems’ GPU Cooling product line includes passive assemblies for NVIDIA and AMD.
Designed to enable peak compute performance in high temperature environments, this Rack DCLC compatible assembly is a direct replacement for the passive heat sink solution.
Featuring two CoolIT Systems R4 coldplates and a full coverage tray, it is capable of capturing more than 90% of the heat load generated by the card, maximizing reliability and lifespan.
CoolIT Systems manufactures a direct contact liquid cooling system for the NVIDIA® Tesla® K80 Accelerator.
This passive assembly supports the Rack DCLCTM ecosystem and is deployed in conjunction with any CoolIT Systems Heat Exchange Module. The full coverage K80 solution provides cooling the GPUs, memory and power supply components. Its specialized design captures up to 89% of the heat load, ensures peak performance and improves reliability.
Designed specifically to support the NVIDIA Tesla P100 GPU accelerator, the CoolIT GP1 passive coldplate enables NVIDIA Pascal solutions in 1U applications.
This full coverage coldplate ensures high performance liquid cooling for the entire SXM2 board, and is a drop in replacement for the reference air cooling heatsink.
Based on the same R4 platform that underpins the GP1, CoolIT continues its tradition of offering the highest performance solutions for NVIDIA® products.
Designed specifically for the new Tesla® V100 (Volta™) accelerator, the GP2 enables the highest density SXM2 platforms by pulling the interface points in from the edge of the coldplate, giving the solution designer greater freedom for tube routing.
Designed to enable peak compute performance in high temperature environments, this Rack DCLC compatible assembly is a direct replacement for the passive heat sink solution.
Featuring two CoolIT Systems R4 coldplates and a full coverage tray, it is capable of capturing more than 90% of the heat load generated by the card, maximizing reliability and lifespan.
CoolIT Systems manufactures a direct contact liquid cooling system for the NVIDIA® Tesla® K80 Accelerator.
This passive assembly supports the Rack DCLCTM ecosystem and is deployed in conjunction with any CoolIT Systems Heat Exchange Module. The full coverage K80 solution provides cooling the GPUs, memory and power supply components. Its specialized design captures up to 89% of the heat load, ensures peak performance and improves reliability.
Designed specifically to support the NVIDIA Tesla P100 GPU accelerator, the CoolIT GP1 passive coldplate enables NVIDIA Pascal solutions in 1U applications.
This full coverage coldplate ensures high performance liquid cooling for the entire SXM2 board, and is a drop in replacement for the reference air cooling heatsink.
Based on the same R4 platform that underpins the GP1, CoolIT continues its tradition of offering the highest performance solutions for NVIDIA® products.
Designed specifically for the new Tesla® V100 (Volta™) accelerator, the GP2 enables the highest density SXM2 platforms by pulling the interface points in from the edge of the coldplate, giving the solution designer greater freedom for tube routing.
CoolIT Systems’ full coverage Memory Cooling solutions are designed for both standard height memory modules and custom configurations.
CoolIT Systems’ Mx1 Memory Cooling solution enables full coverage memory cooling.
This solution, designed for standard height memory modules, routes coolant through an integrated channel in the top of the cooler, simplifying design and minimizing costs.
When used in conjunction with CoolIT Systems’ processor Coldplates, up to 85% of the heat produced by each server can be captured in the liquid loop.
CoolIT Systems’ Mx2 Memory Cooling solution enables full coverage memory cooling in 1U chassis.
Designed for standard height memory modules, this solution routes coolant directly through embedded copper tubes, allowing for an extremely low profile.
When used in conjunction with CoolIT Systems’ processor Coldplates, up to 85% of the heat produced by each server can be captured in the liquid loop.
Our premier solution, the Mx3 retains the direct contact copper tubes from the Mx2, but they are no longer fixed to an aluminum frame. This results in not only the highest level of heat capture, but most importantly, allows each memory module to be individually serviceable.
Designed to support up to 30 installation cycles, technicians no longer need to worry about removing the cooling solution to replace each DIMM.
CoolIT Systems’ Mx1 Memory Cooling solution enables full coverage memory cooling.
This solution, designed for standard height memory modules, routes coolant through an integrated channel in the top of the cooler, simplifying design and minimizing costs.
When used in conjunction with CoolIT Systems’ processor Coldplates, up to 85% of the heat produced by each server can be captured in the liquid loop.
CoolIT Systems’ Mx2 Memory Cooling solution enables full coverage memory cooling in 1U chassis.
Designed for standard height memory modules, this solution routes coolant directly through embedded copper tubes, allowing for an extremely low profile.
When used in conjunction with CoolIT Systems’ processor Coldplates, up to 85% of the heat produced by each server can be captured in the liquid loop.
CoolIT Systems’ Mx2 Memory Cooling solution enables full coverage memory cooling in 1U chassis.
Designed for standard height memory modules, this solution routes coolant directly through embedded copper tubes, allowing for an extremely low profile.
When used in conjunction with CoolIT Systems’ processor Coldplates, over 85% of the heat produced by each server can be captured in the liquid loop.
A key component of the Server Module, CoolIT Systems’ patented Split-Flow Coldplates are solid copper components which deliver superior performance for today’s high thermal density processors.
The Split-Flow design uses microchannel architecture to minimize pressure drop, maximize coolant flow, and direct the coolest liquid to the hottest area of the processor first. At only 2.4mm in height, Coldplates are easily integrated into extremely compact, low-profile blade architectures, and allow for optimal performance.
Custom Coldplate designs are available.